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TPS2291L02

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5.5V, 2A, 30mΩ low-current load switch with output discharge

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Data sheet

TPS2291L02

ACTIVE
Data sheet Order now

Product details

Imax (A) 2 Vin (max) (V) 5.5 Vin (min) (V) 1 Number of channels 1 Features Active low, Inrush current control, Quick output discharge Quiescent current (Iq) (typ) (µA) 0.5 Soft start Fixed Rise Time Rating Catalog Ron (typ) (mΩ) 60 Shutdown current (ISD) (typ) (µA) 0.01 Current limit type None Function Inrush current control, Reverse current blocking FET Internal Operating temperature range (°C) -40 to 85 Device type Load switches
Imax (A) 2 Vin (max) (V) 5.5 Vin (min) (V) 1 Number of channels 1 Features Active low, Inrush current control, Quick output discharge Quiescent current (Iq) (typ) (µA) 0.5 Soft start Fixed Rise Time Rating Catalog Ron (typ) (mΩ) 60 Shutdown current (ISD) (typ) (µA) 0.01 Current limit type None Function Inrush current control, Reverse current blocking FET Internal Operating temperature range (°C) -40 to 85 Device type Load switches
DSBGA (YCJ) 4 0.374544 mm² 0.612 x 0.612
  • Integrated Single Channel Load Switch
  • Input operating voltage range (VIN): 1.05V – 5.5V
  • Low On-Resistance (RON)
    • RON = 18.6mΩ (Typ) at VIN ≥ 3.3V
    • RON = 20.1mΩ (Typ) at VIN = 1.8V
    • RON = 23.3mΩ (Typ) at VIN = 1.05V
  • Low power consumption:
    • ON state (IQ): 90nA (typ.)
    • OFF state (ISD): 1.6nA (typ.)
  • Maximum continuous current: 2A
  • Controlled Turn on time of 130µs
  • Quick Output Discharge (QOD): 235Ω (typ.)
  • Thermal shutdown for self protection
  • Smart EN pin pulldown (RPD,EN):
    • EN ≥ VIH (ION): 25nA (max.)
    • EN ≤ VIL (RPD,ON): 530kΩ (typ)
  • Ultra small Wafer Chip Scale Package
    • 0.616mm × 0.616mm , 0.35mm pitch, 0.35mm Height DSBGA(YCJ)
  • ESD performance tested per JESD 22
    • 2kV HBM and 1kV CDM
  • Integrated Single Channel Load Switch
  • Input operating voltage range (VIN): 1.05V – 5.5V
  • Low On-Resistance (RON)
    • RON = 18.6mΩ (Typ) at VIN ≥ 3.3V
    • RON = 20.1mΩ (Typ) at VIN = 1.8V
    • RON = 23.3mΩ (Typ) at VIN = 1.05V
  • Low power consumption:
    • ON state (IQ): 90nA (typ.)
    • OFF state (ISD): 1.6nA (typ.)
  • Maximum continuous current: 2A
  • Controlled Turn on time of 130µs
  • Quick Output Discharge (QOD): 235Ω (typ.)
  • Thermal shutdown for self protection
  • Smart EN pin pulldown (RPD,EN):
    • EN ≥ VIH (ION): 25nA (max.)
    • EN ≤ VIL (RPD,ON): 530kΩ (typ)
  • Ultra small Wafer Chip Scale Package
    • 0.616mm × 0.616mm , 0.35mm pitch, 0.35mm Height DSBGA(YCJ)
  • ESD performance tested per JESD 22
    • 2kV HBM and 1kV CDM

The EN pin controls the state of the switch. The EN pin is compatible with standard GPIO logic threshold so the device can be used in a wide variety of applications. When power is first applied to VIN, a Smart Pulldown is used to keep the EN pin from floating until the system sequencing is complete. After the EN pin is deliberately driven high (≥ VIH), the Smart Pulldown is disconnected to prevent unnecessary power loss. See the below table when the EN Pin Smart Pulldown is active.

The EN pin controls the state of the switch. The EN pin is compatible with standard GPIO logic threshold so the device can be used in a wide variety of applications. When power is first applied to VIN, a Smart Pulldown is used to keep the EN pin from floating until the system sequencing is complete. After the EN pin is deliberately driven high (≥ VIH), the Smart Pulldown is disconnected to prevent unnecessary power loss. See the below table when the EN Pin Smart Pulldown is active.
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* Data sheet TPS22991L02 5.5V, 2A, 22mΩ On-Resistance Ultra Low IQ Load Switch With Quick Output discharge datasheet PDF | HTML 10 Nov 2025
EVM User's guide TPS2291L02-EVM Evaluation Module (Rev. A) PDF | HTML 14 Nov 2025
Certificate TPS2291L02-EVM EU Declaration of Conformity (DoC) 22 Sep 2025

Design & development

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Evaluation board

TPS2291L02-EVM — TPS2291L02 evaluation module

The TPS2291L02 evaluation module (EVM) is a printed circuit board (PCB) containing the TPS2291L02 load switch device. The VIN and VOUT connections to the device and the PCB layout routing are capable of handling high continuous currents and provide a low-resistance pathway into and out of the (...)
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