TI does not offer ongoing direct design support for this hardware. For support while working through your design, contact Shenzhen Shengrun Technology Co., Ltd..
TTC-3P-BLE-SIP-MODULE
Overview
TTC focus on the wireless communication technology and applications for many years, specializing in the application of product protocol stacks such as BLE, WIFI, NFC, Zigbee, Thread, system compatibility, multi-device interconnectivity, comprehensive role applications, and complex positioning algorithms.
SR-2340190I1N SiP solution integrates all features required for a Bluetooth Low Energy aplication, which is a highly-integrated Bluetooth 5.3 module targeted for low-power smart devices and loT applications.
SR-2340190I1N have 26GPIO. The volume is only 12% of the original module solution.
- Smaller Size: 5.0 x 5.0 x 0.75mm
- Operating temperature: -40℃~85℃
- Higher sensitivity
- Localization of Origin
Features
- Powerful 48MHz Arm® Cortex®M0+ processor, 512KB flash, 12KB ROM
- Supports over-the-air upgrade (OTA)
Low-power 2.4-GHz products
Photos courtesy of Shenzhen Shengrun Technology Co., Ltd.
Order & start development
Daughter card
SR-2340190I1N — CC2340 SiP Module
SR-2340190I1N — CC2340 SiP Module
Support & training
Video series
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