1.	Fabrication to meet or exceed class 2 standards prescribed by IPC-A-600 (Commercial Std.)
2.	Materials and construction: Laminate and prepreg per IPC-6012.
3.	Starting copper weight: 1 ounce outer layer and planes.  Can be changed to meet current,thickness and impedance targets.
4.	Finished board thickness 0.062" +/-10%.
5.	Plated through holes shall meet IPC-600, class 2 requirements with an average plating 	thickness of 0.001 and a minimum of 0.0008 with acceptable voiding in accordance with 	IPC-600 class 2 requirements.
6.	Maximum warp and twist to be .005 inch per inch.
7.	Minimum annular ring of plated-through holes to be .002 inches.
8.	5 -15uIN gold over a minimum of 200uIN nickel  All pad surfaces that will be soldered to.
9.	6 mil traces on L1 to be 50 Ohms single ended
10. 	Silkscreen top and bottom side with epoxy-based ink per artwork.
11.	Apply soldermask both sides w/ green LPI per artwork.  It is permissible to use LPI w/non-conductive fill to replace dry film soldermask in via tenting applications.