SCES920B September   2020  – March 2023 SN74LXC8T245-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Switching Characteristics, VCCA = 1.2 ± 0.1 V
    7. 6.7  Switching Characteristics, VCCA = 1.5 ± 0.1 V
    8. 6.8  Switching Characteristics, VCCA = 1.8 ± 0.15 V
    9. 6.9  Switching Characteristics, VCCA = 2.5 ± 0.2 V
    10. 6.10 Switching Characteristics, VCCA = 3.3 ± 0.3 V
    11. 6.11 Switching Characteristics, VCCA = 5.0 ± 0.5 V
    12. 6.12 Switching Characteristics: Tsk, TMAX
    13. 6.13 Operating Characteristics
    14. 6.14 Typical Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1 Load Circuit and Voltage Waveforms
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 CMOS Schmitt-Trigger Inputs with Integrated Pulldowns
        1. 8.3.1.1 I/Os with Integrated Dynamic Pull-Down Resistors
        2. 8.3.1.2 Control Inputs with Integrated Static Pull-Down Resistors
      2. 8.3.2 Balanced High-Drive CMOS Push-Pull Outputs
      3. 8.3.3 Partial Power Down (Ioff)
      4. 8.3.4 VCC Isolation and VCC Disconnect (Ioff-float)
      5. 8.3.5 Over-Voltage Tolerant Inputs
      6. 8.3.6 Glitch-Free Power Supply Sequencing
      7. 8.3.7 Negative Clamping Diodes
      8. 8.3.8 Fully Configurable Dual-Rail Design
      9. 8.3.9 Supports High-Speed Translation
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  10. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DGS|24
  • RHL|24
  • PW|24
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • AEC-Q100 qualified for automotive applications
  • Fully configurable dual-rail design allows each port to operate from 1.1 V to 5.5 V
  • Robust, glitch-free power supply sequencing
  • Up to 420-Mbps support for 3.3 V to 5.0 V
  • Schmitt-trigger inputs allow for slow or noisy inputs
  • I/Os with integrated dynamic pull-down resistors help reduce external component count
  • Control inputs with integrated static pull-down resistors allow for floating control inputs
  • High drive strength (up to 32 mA at 5 V)
  • Low power consumption:
    • 4-µA maximum (25°C)
    • 12-µA maximum (–40°C to 125°C)
  • VCC isolation and VCC disconnect (Ioff-float) feature:
    • If either VCC supply is < 100 mV or disconnected, all I/Os get pulled-down and then become high-impedance
  • Ioff supports partial-power-down mode operation
  • Compatible with LVC family level shifters
  • Control logic (DIR and OE) are referenced to VCCA
  • Operating temperature from –40°C to +125°C
  • Latch-up performance exceeds 100 mA per JESD 78, Class II
  • ESD protection exceeds JESD 22
    • 4000-V Human-Body Model
    • 1000-V Charged-Device Model